Printed circuit assemblies
Parts and accessories (other than covers, carrying cases and the like) suitable for use solely or principally with machines of headings 8470 to 8472: > Parts and accessories equally suitable for use with machines of two or more of the headings 8470 to 8472: > Printed circuit assemblies
Duty Rate (from China)
Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Products classified under HTS 8473.50.30.00
Motherboard for Semiconductor Wafer Steppers
This printed circuit assembly serves as the control board for photolithography steppers used in semiconductor wafer processing, falling under HTS 8473.50.30.00 as a part equally suitable for EDP machines (8471) and semiconductor manufacturing equipment (8473). It manages stepper motor controls, alignment sensors, and data processing interfaces specific to wafer fabrication.
Control PCB for Crystal Pullers
Printed circuit board assembly controlling temperature and rotation in Czochralski crystal pullers for semiconductor boule production, classified under 8473.50.30.00 due to equal suitability with EDP controllers (8471) and semiconductor equipment (8473). It interfaces sensors for precise monocrystalline silicon growth.
Sensor Integration PCA for Wafer Grinders
Printed circuit assembly integrating displacement and vibration sensors for semiconductor wafer grinders, HTS 8473.50.30.00 as equally suitable for 8471 controllers and 8473 grinders. Critical for achieving flatness tolerances in wafer preparation.
Power Distribution Board for Float Zone Crystal Growers
PCA handling high-current RF power distribution for float zone crystal growers in semiconductor material production, under 8473.50.30.00 for use with both 8471 power supplies and 8473 growers. Ensures stable monocrystalline semiconductor boule formation.
Motor Controller Assembly for Wafer Polishers
PCA controlling servo motors and pressure systems in chemical-mechanical wafer polishers for semiconductor fabrication prep, under 8473.50.30.00 for equal use with 8471 motor controllers and 8473 polishers. Achieves mirror-finish wafer surfaces.
Vision System Interface for Crystal Grinders
Printed circuit assembly interfacing CMOS cameras and lighting for automated crystal boule grinding in semiconductor wafer prep, HTS 8473.50.30.00 as usable with 8471 vision systems and 8473 grinders. Ensures precise diameter and flat grinding.
Thermal Management PCA for Wafer Processing
PCA monitoring and controlling heaters/chillers in semiconductor wafer processing equipment, under 8473.50.30.00 for use with 8471 thermal controllers and 8473 thermal systems. Maintains precise temperatures for crystal growth and wafer handling.
RF Signal Processor Board for Plasma Etchers
Printed circuit assembly processing RF impedance matching signals for plasma etching tools in semiconductor device fabrication, HTS 8473.50.30.00 due to equal suitability with 8471 RF boards and 8473 etchers. Enables precise material removal at wafer level.
I/O Expansion Card for Semiconductor Testers
PCIe-based printed circuit assembly providing expanded I/O for parametric testing of semiconductor wafers, under 8473.50.30.00 for compatibility with 8471 expansion cards and 8473 testers. Supports high-pin-count device testing.
Alignment Sensor PCA for Lithography Steppers
Printed circuit assembly processing alignment mark detection signals for semiconductor lithography steppers, HTS 8473.50.30.00 as usable with 8471 image processors and 8473 steppers. Critical for sub-micron overlay accuracy.
Vacuum Control Interface for Wafer Handlers
PCA interfacing vacuum pumps and sensors for robotic wafer handling in semiconductor fabs, under 8473.50.30.00 for use with 8471 robot controllers and 8473 handlers. Prevents wafer contamination during transfer.
Process Gas Controller for Deposition Tools
Printed circuit assembly controlling mass flow controllers for CVD deposition tools in semiconductor manufacturing, HTS 8473.50.30.00 due to equal suitability with 8471 gas controllers and 8473 deposition equipment. Ensures uniform thin film deposition.
Yield Monitoring PCA for Fab Equipment
Printed circuit assembly aggregating yield data from multiple semiconductor processing tools, under 8473.50.30.00 for compatibility with 8471 data aggregators and 8473 fab machines. Supports real-time process optimization.
Interface Board for Wafer Slicing Saws
This PCA provides motor drive interfaces and vision system integration for wafer slicing saws in semiconductor prep, under HTS 8473.50.30.00 for parts usable with 8471 data processors and 8473 saws. It ensures precise slicing from monocrystalline boules.
Data Acquisition PCA for Wafer Lappers
Printed circuit assembly for real-time data acquisition from lapping process sensors in semiconductor wafer prep, HTS 8473.50.30.00 due to compatibility with 8471 acquisition systems and 8473 lappers. Maintains critical surface flatness tolerances.