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8473.50.30.00/Data Acquisition PCA for Wafer Lappers/Japan

Data Acquisition PCA for Wafer Lappers from Japan

Printed circuit assembly for real-time data acquisition from lapping process sensors in semiconductor wafer prep, HTS 8473.50.30.00 due to compatibility with 8471 acquisition systems and 8473 lappers. Maintains critical surface flatness tolerances.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

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