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8473.50.30.00/Data Acquisition PCA for Wafer Lappers/Germany

Data Acquisition PCA for Wafer Lappers from Germany

Printed circuit assembly for real-time data acquisition from lapping process sensors in semiconductor wafer prep, HTS 8473.50.30.00 due to compatibility with 8471 acquisition systems and 8473 lappers. Maintains critical surface flatness tolerances.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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