Data Acquisition PCA for Wafer Lappers from Canada
Printed circuit assembly for real-time data acquisition from lapping process sensors in semiconductor wafer prep, HTS 8473.50.30.00 due to compatibility with 8471 acquisition systems and 8473 lappers. Maintains critical surface flatness tolerances.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide software/firmware specs showing EDP integration capability
• Use HS explanatory notes to justify multi-machine classification in rulings