Wafer Edge Profiling Tool from Mexico
Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.
Duty Rate — Mexico → United States
12%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Reference specific SEMI specs (M1-0302 for edge profiles)
• Match tool geometry to wafer thickness range (50-775μm)