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8473.40.41.00/Wafer Edge Profiling Tool/Mexico

Wafer Edge Profiling Tool from Mexico

Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.

Duty Rate — Mexico → United States

12%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Reference specific SEMI specs (M1-0302 for edge profiles)

• Match tool geometry to wafer thickness range (50-775μm)