8473.40.41.00/Wafer Edge Profiling Tool/Japan

Wafer Edge Profiling Tool from Japan

Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter

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Import Tips

• Reference specific SEMI specs (M1-0302 for edge profiles)

• Match tool geometry to wafer thickness range (50-775μm)