8473.40.41.00/Wafer Edge Profiling Tool/Japan

Wafer Edge Profiling Tool from Japan

Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

Calculate with your customs value Verify classification with AI

Import Tips

• Reference specific SEMI specs (M1-0302 for edge profiles)

• Match tool geometry to wafer thickness range (50-775μm)