8473.40.41.00/Wafer Edge Profiling Tool/Germany

Wafer Edge Profiling Tool from Germany

Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Reference specific SEMI specs (M1-0302 for edge profiles)

• Match tool geometry to wafer thickness range (50-775μm)