8473.40.41.00/Wafer Edge Profiling Tool/Germany

Wafer Edge Profiling Tool from Germany

Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.

Duty Rate — Germany → United States

12%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Reference specific SEMI specs (M1-0302 for edge profiles)

• Match tool geometry to wafer thickness range (50-775μm)