Wafer Edge Profiling Tool from Canada

Precision grinding tool for wafer edge profiling to SEMI standards, preventing chipping during handling in 8472.90.50 preparation equipment. Creates rounded/chamfered edges. HTS 8473.40.41.00 accessory.

Duty Rate — Canada → United States

12%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

Import Tips

Reference specific SEMI specs (M1-0302 for edge profiles)

Match tool geometry to wafer thickness range (50-775μm)

Wafer Edge Profiling Tool from Canada — Import Duty Rate | HTS 8473.40.41.00