8473.40.41.00/Semiconductor Wafer Slicing Saw Blade/Mexico

Semiconductor Wafer Slicing Saw Blade from Mexico

Diamond-impregnated saw blade engineered for inner-diameter (ID) saws that slice monocrystalline semiconductor boules into thin wafers, exclusive to machines of 8472.90.50. It ensures minimal kerf loss and high precision for silicon wafer preparation. Fits HTS 8473.40.41.00 as a dedicated accessory.

Duty Rate — Mexico → United States

12%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Provide blade specs showing diamond grit size and ID compatibility with 8472.90.50 saws for proper classification

• Retain supplier invoices proving purchase for semiconductor fab equipment, not general cutting tools

Semiconductor Wafer Slicing Saw Blade from Mexico — Import Duty Rate | HTS 8473.40.41.00