8473.40.41.00/Semiconductor Wafer Slicing Saw Blade/Germany

Semiconductor Wafer Slicing Saw Blade from Germany

Diamond-impregnated saw blade engineered for inner-diameter (ID) saws that slice monocrystalline semiconductor boules into thin wafers, exclusive to machines of 8472.90.50. It ensures minimal kerf loss and high precision for silicon wafer preparation. Fits HTS 8473.40.41.00 as a dedicated accessory.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Provide blade specs showing diamond grit size and ID compatibility with 8472.90.50 saws for proper classification

• Retain supplier invoices proving purchase for semiconductor fab equipment, not general cutting tools