Semiconductor Wafer Slicing Saw Blade from Canada
Diamond-impregnated saw blade engineered for inner-diameter (ID) saws that slice monocrystalline semiconductor boules into thin wafers, exclusive to machines of 8472.90.50. It ensures minimal kerf loss and high precision for silicon wafer preparation. Fits HTS 8473.40.41.00 as a dedicated accessory.
Duty Rate — Canada → United States
12%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide blade specs showing diamond grit size and ID compatibility with 8472.90.50 saws for proper classification
• Retain supplier invoices proving purchase for semiconductor fab equipment, not general cutting tools