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8473.40.41.00/Semiconductor Wafer Slicing Saw Blade/Canada

Semiconductor Wafer Slicing Saw Blade from Canada

Diamond-impregnated saw blade engineered for inner-diameter (ID) saws that slice monocrystalline semiconductor boules into thin wafers, exclusive to machines of 8472.90.50. It ensures minimal kerf loss and high precision for silicon wafer preparation. Fits HTS 8473.40.41.00 as a dedicated accessory.

Duty Rate — Canada → United States

12%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Provide blade specs showing diamond grit size and ID compatibility with 8472.90.50 saws for proper classification

• Retain supplier invoices proving purchase for semiconductor fab equipment, not general cutting tools

Semiconductor Wafer Slicing Saw Blade from Canada — Import Duty Rate | HTS 8473.40.41.00