Semiconductor Wafer Handling Chuck from Mexico
Vacuum or electrostatic chuck for precise wafer holding during grinding, lapping, and polishing in 8472.90.50 machines. Features porous ceramic surface for uniform vacuum distribution. HTS 8473.40.41.00 for semiconductor-specific parts.
Duty Rate — Mexico → United States
12%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Specify chuck diameter (200/300/450mm) and holding force specs for wafer size
• Provide porosity and material certs (aluminum oxide ceramic) for classification