Semiconductor Wafer Handling Chuck from Japan
Vacuum or electrostatic chuck for precise wafer holding during grinding, lapping, and polishing in 8472.90.50 machines. Features porous ceramic surface for uniform vacuum distribution. HTS 8473.40.41.00 for semiconductor-specific parts.
Duty Rate — Japan → United States
12%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify chuck diameter (200/300/450mm) and holding force specs for wafer size
• Provide porosity and material certs (aluminum oxide ceramic) for classification