Semiconductor Wafer Handling Chuck from Germany
Vacuum or electrostatic chuck for precise wafer holding during grinding, lapping, and polishing in 8472.90.50 machines. Features porous ceramic surface for uniform vacuum distribution. HTS 8473.40.41.00 for semiconductor-specific parts.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify chuck diameter (200/300/450mm) and holding force specs for wafer size
• Provide porosity and material certs (aluminum oxide ceramic) for classification