8473.40.41.00/CMP Wafer Polishing Pad Conditioner/Japan

CMP Wafer Polishing Pad Conditioner from Japan

Diamond disk conditioner for dressing chemical mechanical polishing (CMP) pads used in 8472.90.50 polishers during semiconductor wafer fabrication. Maintains pad surface asperity for uniform material removal. Fits as accessory in HTS 8473.40.41.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Detail diamond pattern (e.g

• hexagonal, crosshatch) and pad compatibility (400-600mm)

• Include CMP process validation data linking to semiconductor wafer planarity specs