8473.40.41.00/CMP Wafer Polishing Pad Conditioner/Germany

CMP Wafer Polishing Pad Conditioner from Germany

Diamond disk conditioner for dressing chemical mechanical polishing (CMP) pads used in 8472.90.50 polishers during semiconductor wafer fabrication. Maintains pad surface asperity for uniform material removal. Fits as accessory in HTS 8473.40.41.00.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%

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Import Tips

• Detail diamond pattern (e.g

• hexagonal, crosshatch) and pad compatibility (400-600mm)

• Include CMP process validation data linking to semiconductor wafer planarity specs