Wafer Thickness Mapping System from Japan
System mapping wafer thickness uniformity across surface for quality control in preparation process. Accessory principally for 8471 semiconductor machines in HTS 8473.30.91.00.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify mapping resolution (e.g
• 1μm); SEMI standards compliance; vibration isolation requirements