Wafer Thickness Mapping System from Canada
System mapping wafer thickness uniformity across surface for quality control in preparation process. Accessory principally for 8471 semiconductor machines in HTS 8473.30.91.00.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify mapping resolution (e.g
• 1μm); SEMI standards compliance; vibration isolation requirements