Wafer Slicing Diamond Saw from Mexico
High-precision diamond wire or blade saw for slicing thin wafers from monocrystalline semiconductor boules, as noted in statistical note (a)(ii)(B). A dedicated accessory for 8471 machines under HTS 8473.30.91.00.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Specify kerf loss and wafer thickness capabilities; ensure diamond wire tensioning system is documented; check for hazardous material declarations on coolants