Double-Sided Wafer Polisher from Germany
Polishing machine that simultaneously processes both sides of semiconductor wafers to mirror finish and precise flatness, per statistical note. Accessory for heading 8471 under HTS 8473.30.91.00.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide polishing pad and slurry specifications; validate for total thickness variation (TTV); include cleanroom certification