Diamond Slurry Dispenser for Wafer Prep from Japan
Precision dispenser for colloidal diamond slurry used in wafer grinding/lapping/polishing operations. Specialized accessory for 8471 machines under HTS 8473.30.91.00.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• Declare particle size distribution; ensure contamination-free materials; pressure/flow specs required