Silicon Wafer Lapping Plate from Germany
Cast iron or copper plate used with abrasive slurries to lap semiconductor wafers to precise flatness tolerances before polishing. Accessory for heading 8471 wafer preparation equipment. HTS 8473.30.51.00 for non-CRT parts in semiconductor processing.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include flatness specs (e.g
• <0.5 microns) and slurry compatibility details
• Customs may require proof of semiconductor end-use; prepare fab customer letters