Semiconductor Wafer Flattening Fixture from Germany
Vacuum chuck fixture that secures wafers during lapping to achieve total indicated runout (TIR) specifications for device fabrication. Part for heading 8471 preparation machines. HTS 8473.30.51.00 for such specialized semiconductor accessories.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify vacuum specs and wafer size range (150-450mm)
• Provide SEMI standards compliance documentation