Semiconductor Crystal Boule Grinder from Japan
Precision grinder that shapes crystal boules to exact diameters and adds flats indicating conductivity and resistivity for wafer production. Accessory solely for heading 8471 wafer preparation machines. HTS 8473.30.51.00 applies as parts without CRT for semiconductor processing.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Certify grinder tolerances meet semiconductor specs (e.g
• <1 micron flatness) for correct heading
• Document absence of CRT and principal 8471 compatibility to customs