Wafer Slicing Saw Controller Board from Germany
Specialized PCA for blade speed and coolant control in diamond saws that slice monocrystalline boules into semiconductor wafers. Classified in HTS 8473.30.1180 as other printed circuit assemblies for 8471 machines without CRTs. Vital for thin, damage-free wafer production.
Duty Rate — Germany → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Provide cut-sheet specs showing integration with boule saws exclusively
• Monitor for diamond blade import bundling; classify separately to avoid set rules