8473.30.11.80/Wafer Lapping Machine Interface PCA/Japan

Wafer Lapping Machine Interface PCA from Japan

Printed circuit board assembly interfacing pressure sensors and motors in lapping equipment that achieves flatness tolerances for semiconductor wafers pre-polishing. HTS 8473.30.1180 applies as a part principally for 8471 wafer preparation machines, no CRT. Ensures mirror-like surface preparation.

Duty Rate — Japan → United States

25%

Rate breakdown

9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
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Import Tips

• Classify based on machine model numbers; cross-reference with 8471 entries

• Anti-static packaging mandatory; document ESD compliance

Wafer Lapping Machine Interface PCA from Japan — Import Duty Rate | HTS 8473.30.11.80