Wafer Grinder Servo Drive PCA from Japan
A printed circuit assembly providing servo control for precision grinding of semiconductor crystal boules to exact diameters in wafer preparation equipment. It qualifies for HTS 8473.30.1180 as a principal part of 8471 heading machines for semiconductor manufacturing, excluding CRTs. Critical for maintaining flatness and conductivity indicators.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Obtain certificates of conformance from OEMs linking the PCA to specific wafer grinder models
• Use HTS advisory opinions for high-value shipments to preempt valuation disputes