Wafer Grinder Servo Drive PCA from China
A printed circuit assembly providing servo control for precision grinding of semiconductor crystal boules to exact diameters in wafer preparation equipment. It qualifies for HTS 8473.30.1180 as a principal part of 8471 heading machines for semiconductor manufacturing, excluding CRTs. Critical for maintaining flatness and conductivity indicators.
Duty Rate — China → United States
50%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Obtain certificates of conformance from OEMs linking the PCA to specific wafer grinder models
• Use HTS advisory opinions for high-value shipments to preempt valuation disputes