8473.30.11.80/Wafer Edge Grinder Vision PCA/Japan

Wafer Edge Grinder Vision PCA from Japan

Printed circuit board for machine vision processing edge profiles during semiconductor wafer edge grinding. HTS 8473.30.1180 for 8471 grinder accessories as other PCAs, CRT-free. Prevents chipping in handling.

Duty Rate — Japan → United States

25%

Rate breakdown

9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter

9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter

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Import Tips

• Pixel resolution/camera specs listed

• Edge bead removal correlation

• Anti-reflective coating compatibility