Etch Chamber Plasma Controller Board from Mexico
Printed circuit assembly generating RF plasma for reactive ion etching of semiconductor wafers in plasma etch tools. HTS 8473.30.1180 for 8471 parts as other PCAs sans CRT. Enables anisotropic pattern transfer.
Duty Rate — Mexico → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
Import Tips
• RF impedance matching network diagrams essential
• Hazardous gas interlocks documented
• EMC compliance for cleanroom RFI