Etch Chamber Plasma Controller Board from Japan
Printed circuit assembly generating RF plasma for reactive ion etching of semiconductor wafers in plasma etch tools. HTS 8473.30.1180 for 8471 parts as other PCAs sans CRT. Enables anisotropic pattern transfer.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.79.0125%Semiconductor articles as provided for in subdivisions (a) and (b) of U.S. note 39 to this subchapter
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• RF impedance matching network diagrams essential
• Hazardous gas interlocks documented
• EMC compliance for cleanroom RFI