Wafer Thickness Measuring Gauge from Mexico
Non-contact capacitive or laser gauges measure semiconductor wafer thickness to nanometer precision during processing. While often Chapter 90, integrated process control units for heading 8470 machines fall under HTS 8473.29.00.00.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Prove integration with automated wafer handling
• Distinguish from standalone metrology tools
• Include RS-232/ethernet fab interface specs