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8473.29.00.00/Wafer Thickness Measuring Gauge/Japan

Wafer Thickness Measuring Gauge from Japan

Non-contact capacitive or laser gauges measure semiconductor wafer thickness to nanometer precision during processing. While often Chapter 90, integrated process control units for heading 8470 machines fall under HTS 8473.29.00.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Prove integration with automated wafer handling

• Distinguish from standalone metrology tools

• Include RS-232/ethernet fab interface specs

Wafer Thickness Measuring Gauge from Japan — Import Duty Rate | HTS 8473.29.00.00