Wafer Thickness Measuring Gauge from China
Non-contact capacitive or laser gauges measure semiconductor wafer thickness to nanometer precision during processing. While often Chapter 90, integrated process control units for heading 8470 machines fall under HTS 8473.29.00.00.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Prove integration with automated wafer handling
• Distinguish from standalone metrology tools
• Include RS-232/ethernet fab interface specs