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8473.29.00.00/Wafer Cooling Station/Japan

Wafer Cooling Station from Japan

Automated stations cool processed semiconductor wafers under controlled atmospheres to prevent thermal shock and contamination. Part of wafer preparation line for heading 8470, HTS 8473.29.00.00.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Specify cooling rates and nitrogen flow specs

• Cleanroom class 100 compatibility

• Integrated vs standalone cooling classified differently

Wafer Cooling Station from Japan — Import Duty Rate | HTS 8473.29.00.00