Wafer Cooling Station from Japan
Automated stations cool processed semiconductor wafers under controlled atmospheres to prevent thermal shock and contamination. Part of wafer preparation line for heading 8470, HTS 8473.29.00.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify cooling rates and nitrogen flow specs
• Cleanroom class 100 compatibility
• Integrated vs standalone cooling classified differently