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8473.29.00.00/Single Wafer Lapping Machine/Mexico

Single Wafer Lapping Machine from Mexico

Single wafer lapping machines use abrasive slurries to achieve sub-micron flatness on semiconductor wafers prior to polishing. This precision equipment is an accessory for semiconductor processing machines of heading 8470, classified in HTS 8473.29.00.00.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
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Import Tips

• Include flatness specs (e.g

• <1µm TTV) in technical docs

• Declare slurry compatibility for silicon/gallium arsenide

• Ensure vibration isolation ratings for cleanroom use

Single Wafer Lapping Machine from Mexico — Import Duty Rate | HTS 8473.29.00.00