8473.29.00.00/Single Wafer Lapping Machine/Japan

Single Wafer Lapping Machine from Japan

Single wafer lapping machines use abrasive slurries to achieve sub-micron flatness on semiconductor wafers prior to polishing. This precision equipment is an accessory for semiconductor processing machines of heading 8470, classified in HTS 8473.29.00.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include flatness specs (e.g

• <1µm TTV) in technical docs

• Declare slurry compatibility for silicon/gallium arsenide

• Ensure vibration isolation ratings for cleanroom use