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Silicon Ingot Annealing Furnace from China

Annealing furnaces heat-treat silicon ingots post-grinding to relieve stresses before wafer slicing. Specialized for semiconductor boule processing under heading 8470, it fits HTS 8473.29.00.00.

Duty Rate — China → United States

37.5%

Rate breakdown

9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China

Import Tips

Document temperature uniformity specs (±1°C)

Specify inert gas (argon/nitrogen) purge systems

Classify complete systems vs replacement heating elements