Semiconductor Wafer Slicing Saw from Japan
Diamond wire or blade wafer slicing saws cut ultra-thin semiconductor wafers from monocrystalline boules with minimal material loss and damage. This essential wafer manufacturing apparatus is classified in HTS 8473.29.00.00 as an accessory for heading 8470 semiconductor processing machines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify wire diameter (e.g
• 0.05-0.1mm) and kerf loss specs for classification
• Include safety data sheets for diamond slurry and coolant systems
• Avoid describing as 'jewelry saw' which triggers different gemstone headings