Semiconductor Wafer Slicing Saw from Germany
Diamond wire or blade wafer slicing saws cut ultra-thin semiconductor wafers from monocrystalline boules with minimal material loss and damage. This essential wafer manufacturing apparatus is classified in HTS 8473.29.00.00 as an accessory for heading 8470 semiconductor processing machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify wire diameter (e.g
• 0.05-0.1mm) and kerf loss specs for classification
• Include safety data sheets for diamond slurry and coolant systems
• Avoid describing as 'jewelry saw' which triggers different gemstone headings