Semiconductor Wafer Slicing Saw from Germany
Diamond wire or blade wafer slicing saws cut ultra-thin semiconductor wafers from monocrystalline boules with minimal material loss and damage. This essential wafer manufacturing apparatus is classified in HTS 8473.29.00.00 as an accessory for heading 8470 semiconductor processing machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify wire diameter (e.g
• 0.05-0.1mm) and kerf loss specs for classification
• Include safety data sheets for diamond slurry and coolant systems
• Avoid describing as 'jewelry saw' which triggers different gemstone headings