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8473.29.00.00/Diamond Wire Tensioner/Japan

Diamond Wire Tensioner from Japan

Automatic tension control systems maintain precise wire tension in semiconductor wafer slicing saws. Essential accessory for heading 8470 slicing machines, under HTS 8473.29.00.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include tension range specs (5-50N typical)

• Prove saw-specific mounting interface

• Component kits may have different part numbers