Crystal Boule Grinder from Japan
Crystal boule grinders precisely shape semiconductor crystal ingots to exact diameters and grind orientation flats indicating conductivity and resistivity. As wafer preparation equipment, it qualifies under HTS 8473.29.00.00 for parts of heading 8470 machines used in semiconductor manufacturing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document tolerance specs (e.g
• ±0.1mm diameter) to prove semiconductor application
• Ensure CE marking or equivalent for high-voltage grinding components