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8473.29.00.00/Chemical Mechanical Wafer Polisher/Mexico

Chemical Mechanical Wafer Polisher from Mexico

CMP (Chemical Mechanical Polishing) tools polish semiconductor wafers to atomic-level flatness using slurry and rotating pads. As critical wafer preparation apparatus for heading 8470 machines, classified under HTS 8473.29.00.00.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify pad pressure and platen speed parameters

• Include endpoint detection system descriptions