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8473.29.00.00/Chemical Mechanical Wafer Polisher/Japan

Chemical Mechanical Wafer Polisher from Japan

CMP (Chemical Mechanical Polishing) tools polish semiconductor wafers to atomic-level flatness using slurry and rotating pads. As critical wafer preparation apparatus for heading 8470 machines, classified under HTS 8473.29.00.00.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify pad pressure and platen speed parameters

• Include endpoint detection system descriptions