Chemical Mechanical Wafer Polisher from Japan
CMP (Chemical Mechanical Polishing) tools polish semiconductor wafers to atomic-level flatness using slurry and rotating pads. As critical wafer preparation apparatus for heading 8470 machines, classified under HTS 8473.29.00.00.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify pad pressure and platen speed parameters
• Include endpoint detection system descriptions