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8473.29.00.00/Chemical Mechanical Wafer Polisher/Germany

Chemical Mechanical Wafer Polisher from Germany

CMP (Chemical Mechanical Polishing) tools polish semiconductor wafers to atomic-level flatness using slurry and rotating pads. As critical wafer preparation apparatus for heading 8470 machines, classified under HTS 8473.29.00.00.

Duty Rate — Germany → United States

10%

Rate breakdown

9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
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Import Tips

• Specify pad pressure and platen speed parameters

• Include endpoint detection system descriptions