Wafer Slicing Diamond Saw from Germany
High-precision inner-diameter saw with diamond blade for slicing ultra-thin semiconductor wafers from monocrystalline boules. Classified in HTS 8471.90.00.00 as essential wafer manufacturing apparatus.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify slurry coolant systems and blade specifications in commercial invoice
• Provide evidence of semiconductor end-use to avoid general saw classification