Stress Relief Wafer Annealer from Japan
Thermal processing equipment that anneals semiconductor wafers post-grinding to relieve internal stresses. Falls under HTS 8471.90.00.00 as semiconductor processing apparatus.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Include temperature uniformity specifications and inert gas purging systems
• Provide ramp rate control and wafer boat handling documentation
• Differentiate from general ovens with semiconductor thermal budget requirements