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8471.90.00.00/Gallium Arsenide Wafer Grinder/Mexico

Gallium Arsenide Wafer Grinder from Mexico

Specialized grinder for compound semiconductor wafers like gallium arsenide, handling brittle materials with minimal subsurface damage. Under HTS 8471.90.00.00 for semiconductor wafer preparation.

Duty Rate — Mexico → United States

25%

Rate breakdown

9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
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Import Tips

• Specify low-damage grinding parameters and material compatibility certifications

• Include handling systems for fragile compound semiconductor wafers

• Document differences from silicon processing to justify semiconductor classification

Gallium Arsenide Wafer Grinder from Mexico — Import Duty Rate | HTS 8471.90.00.00