Gallium Arsenide Wafer Grinder from Germany
Specialized grinder for compound semiconductor wafers like gallium arsenide, handling brittle materials with minimal subsurface damage. Under HTS 8471.90.00.00 for semiconductor wafer preparation.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify low-damage grinding parameters and material compatibility certifications
• Include handling systems for fragile compound semiconductor wafers
• Document differences from silicon processing to justify semiconductor classification