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8471.90.00.00/Double-Sided Wafer Lapper/Mexico

Double-Sided Wafer Lapper from Mexico

Machine that simultaneously laps both sides of semiconductor wafers using rotating lapping plates and carrier systems. Classified under HTS 8471.90.00.00 for wafer surface preparation.

Duty Rate — Mexico → United States

25%

Rate breakdown

9903.94.0525%Except for products described in headings 9903.94.06, 9903.94.32, 9903.94.33, 9903.94.42, 9903.94.43, 9903.94.44, 9903.94.45, 9903.94.52, 9903.94.53, 9903.94.54, 9903.94.55, 9903.94.62, 9903.94.63, 9903.94.66 and 9903.94.67, automobile parts, as provided for in subdivision (g) of U.S. note 33 to this subchapter
9903.05.860%Universal product exemption (U.S. note 52(b))
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
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Import Tips

• Detail carrier plate design and lapping plate conditioning systems

• Include thickness uniformity and parallelism measurement capabilities

Double-Sided Wafer Lapper from Mexico — Import Duty Rate | HTS 8471.90.00.00